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Accueil > News et événements > Press Release > enova 2013

Datapaq at enova 2013

Temperature profiles of reflow processes
octobre 02, 2013
Cambridge, UK - Datapaq will be at the enova 2013 exhibition in Paris in hall 7.2, at stand G43. The manufacturer of temperature measurement and analysis systems for almost any industrial heat treatment process presents a dedicated portfolio for the electronics industry. Reflow Trackers pass through SMT processes along with the printed circuit boards, compiling detailed temperature profiles and, if required, providing data for real-time monitoring via radio. Suitable for reflow soldering processes, wave, vapor phase, and selective soldering, as well as rework stations, the systems help reduce reject rates and increase yield. The accompanying Easy Oven Setup (EOS) software can automatically determine the optimal oven recipe for specific products as well as facilities, rendering consecutive test runs unnecessary and thereby saving much time and effort. Moreover, a variety of data loggers and thermal barriers enables the manufacturer to configure suitable systems for any process irrespective of space constraints, process duration, or maximum temperatures. Datapaq also supplies alternatives to test circuit boards: a sensor fixture and a wave solder pallet. Both support high repeatability, allowing users to fulfill the documentation requirements of the automotive industry, for instance.
 

Figure: At the enova 2013 in Paris, Datapaq shows temperature measurement and analysis systems developed in close cooperation with manufacturers in the sector



 
 
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