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Accueil > News et événements > Press Release > New solution for profiling vacuum ovens and furnaces

In-process temperature profiling in the solar industry: New solution for profiling vacuum ovens and furnaces

mars 25, 2014

Cambridge, UK – Datapaq provides the first ever temperature profiling system designed specifically for use in hot vacuum processes. Measuring accurate product temperatures in these processes has always been a challenge as the airlocks and seals prevent the use of trailing thermocouples. The Datapaq in-process profiler passes through the process chambers along with the product being measured. It uses short thermocouples to take measurements directly from the product at all stages of the process. Thus, users can check uniformity of heating at every stage of the process and optimize the process settings to improve both product quality and production yields. Up to six thermocouples are attached to the Q18 data logger which records detailed temperature profiles. The logger is protected from the heat of the furnace by a revolutionary low-height reflective-plate technology thermal barrier (type VB7400) that has been designed to ensure there is no outgassing. As a consequence of this, profiling can be conducted regularly with minimal process disruption. The system is completed by the comprehensive Insight analysis software. This easy to use software translates the temperature readings into meaningful information quickly, clearly and easily, enabling the engineers to focus on optimizing the process.

Datapaq Vacuum Barrier Figure: The barrier is low enough to enter the process with the product. The use of reflective plates ensures no outgassing.


 
 
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