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Accueil > News et événements > Press Release > Datapaq at SMT Hybrid Packaging 2013

Reflow Tracker compiles and analyzes temperature profiles

Datapaq at SMT Hybrid Packaging 2013
mars 14, 2013
Cambridge, UK - Datapaq presents temperature measurement systems for the electronics industry at the SMT Hybrid Packaging 2013 exhibition in Nuremberg, Germany, in Hall 7, at Stand 513. Reflow Tracker systems are used in reflow soldering processes as well as in wave, vapor phase, and selective soldering, and at rework stations. They help reduce reject rates and increase yield. Melting the solder with optimal energy consumption but without damaging the electrical components requires precise temperature control. The systems pass through SMT processes along with the printed circuit boards, providing data for real-time monitoring via radio, if required. Temperature profiles from up to twelve thermocouples per data logger can be displayed and analyzed with the accompanying software. User-friendly tools support analysis, oven setup, and the determination of the optimal oven recipe for simple as well as complex components.
Datapaq Booth Figure: At the SMT Hybrid Packaging 2013 in Nuremberg, Datapaq shows temperature measurement and analysis systems developed in close cooperation with manufacturers in the sector

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