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Accueil > News et événements > Press Release > Datapaq at SMT Hybrid Packaging 2014

Datapaq at SMT Hybrid Packaging 2014 exhibition

Direct temperature measurement in solder processes
février 20, 2014

Cambridge, UK – Datapaq will exhibit at the SMT Hybrid Packaging trade show (Hall 7, Stand 513). The company advises electronics manufacturers about quality control in various solder processes and shows temperature measurement solutions based on the Q18 data logger series: "Reflow Trackers" from Datapaq monitor wave and reflow soldering, vapor phase soldering, selective soldering as well as solder work at repair stations. Compact thermal barriers and specially adapted transport frames enable the systems to pass through the entire processes along with the printed circuit boards, profiling all phases including preheat in detail. The accompanying software visualizes temperature profiles from up to twelve thermocouples per logger. Automatic analysis, conclusive traffic light signals, and programmable alarms instantly show whether the profile is within the tolerance limits. Trend analyses enable preventive adjustments and thereby support maximum utilization of capacities. Software functions such as Easy Oven Setup and Rapid Oven Setup are available for an easy automatic determination of oven recipes, saving much time, for instance during product changes.

Figure: At the SMT Hybrid Packaging 2014 exhibition in Nuremberg, Datapaq will present temperature measurement and analysis systems for SMT solder processes


 
 
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